Almost two months ago, the Ryzen 7 9850X3D was initially leaked as part of AMD’s upcoming X3D refresh for the Zen 5 lineup, which was later made official by a website entry, indicating that a launch was right around the corner.
That same tipster is now back with a leaked shipping manifest that lists the primary specs of the CPU, confirming it has a 120W TDP.
The manifest shows an internal date of 18 October 2025, which lines up perfectly with the original leaks that first unveiled the 9850X3D to us. The part number is listed as “100-000001973-00,” before which we can see the “120W” mentioned in the name. We don’t have pricing or availability yet, but it should be around the $450 mark, now that we know AMD CPUs aren’t due for a price hike.
TSMC’s advanced packaging tech allowed AMD to put the extra 3D V-Cache right underneath the CCD in Ryzen 9000, which leads to less latency, improved clocks, and less cooling required to keep everything under control. Add simple binning to that list, along with some firmware optimization, and you have the 9850X3D, which should offer a tiny bit more FPS in games across the board.
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